COM Express Carrier Board
// Micro-ATX COM Express Carrier Board
// 1 x G-LAN
// 8 x USB
// 2 x Seriell I/O
// Digital I/O (8-Bit)
// 4 x PCIe x1
// 1 x PCIe x16
Sales only to business customers.
Delivery time: upon request
Basic Module: DFI COM332-B(R.B1)
| General information | ||||
| SKU / Item Number | COM332-B(R.B1) | |||
| Product Basic Data | ||||
| Manufacturer | DFI | |||
| Product ID | 770-CM3322-000G | |||
| Extension | ||||
| PCIe x1 | x1 Signal | 4 Pce | ||
| PCIe x16 | x16 signal | Quantity | 1 Pce | |
| PCIe Interfaces | 4x PCIe x1, 1x PCIe x16 | |||
| M.2 | Slot 1 | Key ID | M | |
| Supported dimensions | 2280 | |||
| M.2 Key IDs | M | |||
| SDIO | Specification | Version 3.0 (SDIO) | ||
| Audio | ||||
| Chipset | Realtek ALC888S-VD2-GR | |||
| External I/O | ||||
| Ethernet | RJ-45 | 1 Pce | ||
| USB | USB 2.0 | 4 Pce | ||
| USB 3.1 Gen 2 | 4 Pce | |||
| Display | DisplayPort | 3 Pce | ||
| Audio | Line-in | 1 Pce | ||
| Line Out | 1 Pce | |||
| Mic-In | 1 Pce | |||
| Internal I/O | ||||
| Serial | RS-232 | Ports (2.54 mm pitch) | 2 Pce | |
| Display | LCD / Inverter Power | Yes | ||
| LVDS connectors | 1 Pce | |||
| eDP (Embedded DisplayPort) lanes | 1 Pce | |||
| VGA (2.54 mm pitch) | 1 Pce | |||
| Digital I/O | Bits | 8-bit | 1 Pce | |
| SMBus | 1 Pce | |||
| LPC | 1 Pce | |||
| I²C (Inter-Integrated Circuit) | 1 Pce | |||
| Audio | Line Out | 1 Pce | ||
| Mic-In | 1 Pce | |||
| S/PDIF | available | |||
| Serial ATA | SATA R3.0 (6 Gbit/s, 600 MB/s) | 4 Pce | ||
| Power Supply | ||||
| Typ (Input) | ATX | Connector | 4-pin ATX (12V DC), 24-pin ATX | |
| Power supply - Input | ATX: 4-pin ATX (12V DC), 24-pin ATX | |||
| Real-Time Clock (RTC) Battery | CR2032 coin cell battery | |||
| Output current | ||||
| Typ (Input) | DC | Range | VCC_RTC (AT Mode), 12V | |
| Connector | COM Express connector (220 pins, Row A + B) | |||
| DC | Range | VCC_RTC (ATX Mode), 12V, 5V Standby | ||
| Connector | COM Express connector (220 pins, Row A + B) | |||
| Mechanical / Environment | ||||
| Temperature | Operation | 0° to 60°C | ||
| Storage | -40°C to 85°C | |||
| Relative humidity | Operation | 5 to 90%, non-condensing | ||
| Storage | 5 to 90%, non-condensing | |||
| Dimensions | Form factor | Micro-ATX | ||
| Width | 244 mm | |||
| Deep | 244 mm | |||
| MTBF (Mean Time Between Failures) | MTBF at 25°C | 488,117 h | ||
| MTBF at 45°C | 253,684 h | |||
| MTBF at 60°C | 136,621 h | |||
| Calculation model | Telcordia Issue 2, Method Case 3 | |||
| Environment | GB, GC – Ground Benign, Controlled | |||
| Certificates / Conformities | ||||
| Compatibility | PICMG COM Express R2.1, Typ 6 | |||
| RoHS compliant | Yes | |||
We are happy to advise you personally.
