COM Express Carrier Board
// Micro-ATX COM Express Carrier Board
// 1 x G-LAN
// 8 x USB
// 2 x Seriell I/O
// Digital I/O (8-Bit)
// 6 x PCIe x1
// 1 x PCIe x16
// 2 x Mini-PCIe
Sales only to business customers.
Delivery time: upon request
Basic Module: DFI COM332-B(R.A)
General information | ||||
SKU / Item Number | COM332-B(R.A) | |||
Product Basic Data | ||||
Manufacturer | DFI | |||
Product ID | 770-CM3321-000G | |||
Extension | ||||
PCIe x1 | x1 Signal | 6 Pce | ||
PCIe x16 | x16 signal | Quantity | 1 Pce | |
Mini-PCIe | Full installation depth | Quantity | 2 Pce | |
PCIe Interfaces | 6x PCIe x1, 1x PCIe x16, 2x Mini-PCIe slots | |||
Storage | SDIO / MMC card | |||
Audio | ||||
Chipset | Realtek ALC888S-VD2-GR | |||
External I/O | ||||
Ethernet | RJ-45 | 1 Pce | ||
USB | USB 2.0 | 4 Pce | ||
USB 3.0 | 4 Pce | |||
Display | DisplayPort | 3 Pce | ||
Audio | Line-in | 1 Pce | ||
Line Out | 1 Pce | |||
Mic-In | 1 Pce | |||
Internal I/O | ||||
Serial | RS-232 | Ports (2.54 mm pitch) | 2 Pce | |
Display | LCD / Inverter Power | Yes | ||
LVDS connectors | 1 Pce | |||
eDP (Embedded DisplayPort) lanes | 1 Pce | |||
VGA (2.54 mm pitch) | 1 Pce | |||
Digital I/O | Bits | 8-bit | 1 Pce | |
SMBus | 1 Pce | |||
LPC | 1 Pce | |||
I²C (Inter-Integrated Circuit) | 1 Pce | |||
Audio | Line Out | 1 Pce | ||
Mic-In | 1 Pce | |||
S/PDIF | available | |||
Serial ATA | SATA R3.0 (6 Gbit/s, 600 MB/s) | 4 Pce | ||
Power Supply | ||||
Typ (Input) | ATX | Connector | 4-pin ATX (12V DC), 24-pin ATX | |
Power supply - Input | ATX: 4-pin ATX (12V DC), 24-pin ATX | |||
Real-Time Clock (RTC) Battery | CR2032 coin cell battery | |||
Output current | ||||
Typ (Input) | DC | Range | VCC_RTC (AT Mode), 12V | |
Connector | COM Express connector (220 pins, Row A + B) | |||
DC | Range | VCC_RTC (ATX Mode), 12V, 5V Standby | ||
Connector | COM Express connector (220 pins, Row A + B) | |||
Mechanical / Environment | ||||
Temperature | Operation | 0° to 60°C | ||
Storage | -40°C to 85°C | |||
Relative humidity | Operation | 5 to 90%, non-condensing | ||
Storage | 5 to 90%, non-condensing | |||
Dimensions | Form factor | Micro-ATX | ||
Width | 244 mm | |||
Deep | 244 mm | |||
MTBF (Mean Time Between Failures) | MTBF at 25°C | 488,117 h | ||
MTBF at 45°C | 253,684 h | |||
MTBF at 60°C | 136,621 h | |||
Calculation model | Telcordia Issue 2, Method Case 3 | |||
Environment | GB, GC – Ground Benign, Controlled | |||
Certificates / Conformities | ||||
Compatibility | PICMG COM Express R2.1, Typ 6 | |||
RoHS compliant | Yes |
We are happy to advise you personally.