DFI COM836

COM-HPC Carrier Board

PRODUCT FEATURES

// E-ATX COM-HPC Carrier Board
// 2 x G-LAN
// 6 x USB
// 2 x Seriell I/O
// Digital I/O (8-Bit)
// 5 x PCIe x4
// 1 x PCIe x16

PRODUCT PRICE

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Sales only to business customers.
Delivery time: upon request

PRODUCT INFORMATION

Basic Module: DFI COM836

General information
SKU / Item NumberCOM836
Product Basic Data
ManufacturerDFI
Product ID770-COM8361-000G
Extension
PCIe x4x4 signal5 Pce
PCIe x16x16 signalQuantity1 Pce
PCIe Interfaces5x PCIe x4, 1x PCIe x16
M.2Slot 1Key IDB
Supported dimensions3052
Slot 2Key IDE
Supported dimensions2242
Slot 3Key IDM
Supported dimensions2242, 2260, 2280
M.2 Key IDsB, E, M
SIMQuantity1 Pce
Form Factor (Slot)Micro SIM
Audio
ChipsetRealtek ALC888
External I/O
EthernetRJ-452 Pce
USBUSB 3.2 (Gen 1)4 Pce
USB v3.2 (Gen 2, Type C)2 Pce
DisplayHDMI1 Pce
DP++2 Pce
AudioLine-in1 Pce
Line Out1 Pce
Mic-In1 Pce
Internal I/O
SerialRS-232 / 422 / 485Ports (2.54 mm pitch)2 Pce
DisplayeDP (Embedded DisplayPort) lanes1 Pce
Digital I/OBits4-bit1 Pce
8-bit1 Pce
SMBus1 Pce
Serial Peripheral Interface (SPI)1 Pce
AudioConnector2.00 mm pitch
Line-in1 Pce
Line Out1 Pce
Mic-In1 Pce
S/PDIFavailable
Serial ATASATA R3.0 (6 Gbit/s, 600 MB/s)2 Pce
Power Supply
Typ (Input)ATXConnector8-pin ATX (12V DC)
Power supply - InputATX: 8-pin ATX (12V DC)
Real-Time Clock (RTC) BatteryCR2032 coin cell battery
Mechanical / Environment
TemperatureOperation0° to 60°C
Storage-40°C to 85°C
Relative humidityOperation5 to 90%, non-condensing
Storage5 to 90%, non-condensing
DimensionsForm factorE-ATX
Width325 mm
Deep340 mm
Certificates / Conformities
CEYes
FCCClass AYes
CompatibilityPICMG COM HPC R2.0 Carrier Board
RoHS compliantYes
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