DFI AP700

Qseven (Q7)

The product is EOL (End Of Life)!

PRODUCT FEATURES

// Qseven (Q7)
// Qualcomm Snapdragon 820 (APQ8096)
// LVDS
// 1 x G-LAN
// 11 x USB (internal)
// Digital I/O (8-Bit)
// 1 x PCIe x1

PRODUCT PRICE

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Sales only to business customers.
Delivery time: upon request

PRODUCT INFORMATION

Basic Module: DFI AP700

General information
SKU / Item NumberAP700
Product Basic Data
ManufacturerDFI
System
ProcessorSeriesQualcomm Snapdragon
NumberQualcomm Snapdragon 820 (APQ8096)
CPU cores4 Pce
Max Turbo Frequency2,2 GHz
Lithography14 nm
MemoryMemory TypeDDR4
Maximum expansion6 GB
Graphics
Screens (Multi-display)2 displays
HDMIMaximum resolution3840 x 2400 at 60 Hz
Version2.0
LVDS (Low Voltage Differential Signaling)Maximum resolution2560 x 1600 at 60 Hz
Bits24-bit
Extension
PCIe x1x1 Signal (Interface)1 Pce
PCIe Interfaces1x PCIe x1
Network
G-LANControllerChipsetAtheros AR8151 (10/100/1000 Mbps)
Quantity1 Pce
Network1x G-LAN
Internal I/O
USBUSB 2.0Interface3 Pce
USB 3.0Interface7 Pce
USB On-The-Go (USB OTG)Interface1 Pce
DisplayLVDS (Low Voltage Differential Signaling)Dual channel
LVDS interface1 Pce
Digital I/OBits8-bit1 Pce
I²C (Inter-Integrated Circuit)1 Pce
UARTTx/Rx/CTS/RTS1 Pce
Serial ATASATA R3.0 (Interface)1 Pce
Watchdog Timer
Watchdog TimerYes
Watchdog timer (interval)Programmable via software (1 - 255 seconds)
Power Supply
Typ (Input)DCRangeVCC_RTC (ATX Mode), 5V, 5VSB
Power supply - InputDC: VCC_RTC (ATX mode), 5V, 5VSB
Mechanical / Environment
TemperatureOperation0° to 60°C
Storage-30°C to 80°C
Relative humidityOperation5 to 90%, non-condensing
Storage5 to 90%, non-condensing
DimensionsForm factorQseven (Q7)
Width70 mm
Deep70 mm
Certificates / Conformities
CompatibilityQseven (Q7) Specification Revision 2.1
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