Basic Module: Dynatron B12
General information | ||||
SKU / Item Number | B12 | |||
Product Basic Data | ||||
Manufacturer | Dynatron | |||
System | ||||
Processor | Series | Intel Skylake | ||
Socket | LGA 3647 (P3) | |||
Thermal Design Power (TDP) | 205 W | |||
Cooling | ||||
Implementation | Passive | |||
Passive | Thermal Management | Cooling Fins (Heat Sink) | ||
Heat Pipe | Quantity | 4 Pce | ||
Installation | Screw fastening | |||
Mechanical / Environment | ||||
Dimensions | Form factor | 2U | ||
Width | 90 mm | |||
Deep | 90 mm | |||
Height | 64 mm | |||
Weight | 590 g | |||
Material | Cooper Base + Aluminium stacked fin | |||
Certificates / Conformities | ||||
RoHS compliant | Yes |
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