Dynatron B8

LGA 3647

PRODUCT FEATURES

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Delivery time: upon request

Basic Module: Dynatron B8

General information
	SKU / Item Number			B8
Product Basic Data
	Manufacturer			Dynatron
System
	Processor	Series		Intel Skylake
		Socket		LGA 3647 (P3)
		Thermal Design Power (TDP)		205 W
Cooling
	Implementation			Passive
	Passive	Thermal Management		Cooling Fins (Heat Sink)
		Heat Pipe	Quantity	4 Pce
	Installation			Screw fastening
Mechanical / Environment
	Dimensions	Form factor		2U
		Width		80 mm
		Deep		108 mm
		Height		64 mm
	Weight			600 g
	Material			Cooper Base + Aluminium stacked fin
Certificates / Conformities
	RoHS compliant			Yes