DFI RPP171

RPP171-IB-1315UE, RPP171-IB-U300E, RPP171-IE-1345UE, RPP171-IE-1365UE

Mini-ITX Mainboards

PRODUCT FEATURES

// Mini-ITX Industrial Mainboards
// [Intel Core i3-1315UE | Intel Core i5-1345UE | Intel Core i7-1365UE | Intel U300E]
// SoC (System on a Chip)
// 262-pin SO-DIMM DDR5
// 3 x G-LAN (Back side)
// 5 x USB (Back side)
// 4 x USB (internal)
// 4 x Seriell I/O
// Digital I/O (8-Bit)
// 1 x PCIe x4
// Power Supply DC 12V

CONFIGURATION

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Standard Configuration Custom Configuration

PRODUCT PRICE

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Sales only to business customers.
Delivery time: upon request

Basic Module: DFI RPP171

General information
SKU / Item NumberRPP171RPP171-IB-1315UE, 770-RPP1711-200G, RPP171-IB-U300E, 770-RPP1711-300G, RPP171-IE-1345UE, 770-RPP1711-100G, RPP171-IE-1365UE, 770-RPP1711-000G
Product Basic Data
ManufacturerDFI
Product ID770-RPP1711-000G, 770-RPP1711-100G, 770-RPP1711-200G, 770-RPP1711-300G
System
ProcessorVertical SegmentEmbedded
SeriesIntel Raptor Lake
NumberIntel Core i3-1315UE, Intel Core i5-1345UE, Intel Core i7-1365UE, Intel U300E
CPU cores5 Pce, 6 Pce, 10 Pce
Threads6 Pce, 8 Pce, 12 Pce
SocketBGA 1744
Base frequency1,1 GHz, 1,2 GHz, 1,4 GHz, 1,7 GHz
Performance Core Max Turbo Frequency4,3 GHz, 4,5 GHz, 4,6 GHz, 4,9 GHz
Efficient-core Max Turbo Frequency3,2 GHz, 3,3 GHz, 3,4 GHz, 3,7 GHz
Cache8 MB, 10 MB, 12 MB
Thermal Design Power (TDP)12 W, 15 W
ChipsetSoC (System on a Chip)
MemoryStructure262-pin SO-DIMM DDR5
Memory TypeDDR5
DIMM TypeUnbuffered SO-DIMM
Frequency5200 MHz
Slots2 Pce
Maximum expansion64 GB
ECC (Error-Correcting Code)-, is supported
BIOSAMI SPI 256 Mbit
Graphics
ProcessorIntel Iris Xe Graphics, Intel UHD Graphics
Screens (Multi-display)4 displays
HDMIMaximum resolution4096 x 2160 at 30 Hz
DisplayPortMaximum resolution4096 x 2304 at 60 Hz
Extension
PCIe x4Generation4
x4 signal1 Pce
PCIe Interfaces1x PCIe x4
M.2Slot 1Key IDM
InterfaceNVMe, PCIe ×4 (Gen 4)
Supported dimensions2242, 2280
Slot 2Key IDB
InterfacePCIe ×1 (Gen 3), USB 2.0, USB 3.2 Gen 2
Supported dimensions2242, 3042, 3052
Slot 3Key IDE
InterfaceCNVi (Connected Network Interface), PCIe ×1 (Gen 3), USB 2.0
Supported dimensions2230
Slot 4Key IDA
Supported dimensions2230
M.2 Key IDsB, E, M
SIMQuantity1 Pce
Form Factor (Slot)Nano SIM
StorageM.2
Audio
ChipsetRealtek ALC888S-VD2-GR
Network
G-LANControllerChipsetIntel I226IT PCIe (10/100/1000/2500 Mbps), Intel I226LM PCIe (10/100/1000/2500 Mbps)
Quantity1 Pce
ControllerChipsetIntel I226IT PCIe (10/100/1000/2500 Mbps), Intel I226V PCIe (10/100/1000/2500 Mbps)
Quantity2 Pce
Network3x G-LAN
Externe I/O (Rear Panel)
DisplayDP / HDMI dual connector2 Pce
DP USB-C1 Pce
EthernetRJ-453 Pce
USBUSB 3.2 (Gen 2)4 Pce
USB v3.2 (Gen 2, Type C)1 Pce
Internal I/O
USBUSB 2.0Ports (2.00 mm pitch)4 Pce
SerialRS-232Ports (2.00 mm pitch)2 Pce
RS-232 / 422 / 485Ports (2.00 mm pitch)2 Pce
Digital I/OBits8-bit1 Pce
SMBus1 Pce
Serial Peripheral Interface (SPI)1 Pce
AudioConnector2.00 mm pitch
Line-in1 Pce
Mic-In1 Pce
Serial ATASATA R3.0 (6 Gbit/s, 600 MB/s)2 Pce
Power connection (onboard)1 Pce
Watchdog Timer
Watchdog TimerYes
Watchdog timer (interval)Programmable via software (1 - 255 seconds)
Safety
Trusted Platform Module (TPM)dTPM 2.0 (Hardware)
Power Supply
Typ (Input)DCWide RangeNo
Range12V
ConnectorDC Power Jack
Power supply - InputDC: 12V
Real-Time Clock (RTC) BatteryCR2032 coin cell battery
OS / Software
Windows EmbeddedWindows 10 Enterprise IoT LTSB (2016)is supported
LinuxDistributionLinux
Supported OSLinux, Windows Embedded
Mechanical / Environment
TemperatureOperation-5° to 65°C, -20° down to 70°C
Storage-40°C to 85°C
Relative humidityOperation5 to 95%, non-condensing
Storage5 to 95%, non-condensing
DimensionsForm factorMini-ITX
Width170 mm
Deep170 mm
Certificates / Conformities
CEYes
FCCClass BYes
Additional certificates / compliance approvalsUKCA
RoHS compliantYes
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