DFI TGU171

TGU171-IB-1115G4E, TGU171-IB-6305E, TGU171-IE-1145GRE, TGU171-IE-1185GRE

Thin Mini-ITX Mainboards

PRODUCT FEATURES

// Thin Mini-ITX Industrial Mainboards
// [Intel Celeron 6305E | Intel Core i3-1115G4E | Intel Core i5-1145GRE | Intel Core i7-1185GRE]
// SoC (System on a Chip)
// 260-pin DDR4 SO-DIMM
// LVDS
// 3 x G-LAN (Back side)
// 5 x USB (Back side)
// 4 x USB (internal)
// 4 x Seriell I/O
// Digital I/O (8-Bit)
// 1 x PCIe x4
// Power Supply DC 12V

CONFIGURATION

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PRODUCT PRICE

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Sales only to business customers.
Delivery time: upon request

Basic Module: DFI TGU171

General information
SKU / Item NumberTGU171TGU171-IB-1115G4E, 770-TGU1711-200G, TGU171-IB-6305E, 770-TGU1711-300G, TGU171-IE-1145GRE, 770-TGU1711-100G, TGU171-IE-1185GRE, 770-TGU1711-000G
Product Basic Data
ManufacturerDFI
Product ID770-TGU1711-000G, 770-TGU1711-100G, 770-TGU1711-200G, 770-TGU1711-300G
System
ProcessorVertical SegmentEmbedded
SeriesIntel Tiger Lake
NumberIntel Celeron 6305E, Intel Core i3-1115G4E, Intel Core i5-1145GRE, Intel Core i7-1185GRE
CPU cores2 Pce, 4 Pce
Threads2 Pce, 4 Pce, 8 Pce
SocketBGA 1449
Base frequency1,5 GHz, 1,8 GHz, 2,2 GHz
Max Turbo Frequency3,9 GHz, 4,1 GHz, 4,4 GHz, -
Cache4 MB, 6 MB, 8 MB, 12 MB
Thermal Design Power (TDP)15 W
Lithography10 nm
ChipsetSoC (System on a Chip)
MemoryStructure260-pin DDR4 SO-DIMM
Memory TypeDDR4
Frequency3200 MHz
Slots2 Pce
Maximum expansion64 GB
BIOSAMI SPI 256 Mbit
Graphics
ProcessorIntel Iris Xe Graphics, Intel UHD Gen 11 LP
Screens (Multi-display)4 displays
HDMIMaximum resolution4096 x 2160 at 60 Hz
DisplayPortMaximum resolution4096 x 2304 at 60 Hz
Dual modeYes (DP++)
LVDS (Low Voltage Differential Signaling)Maximum resolution1920 x 1200 at 60 Hz
eDP (Embedded DisplayPort)Maximum resolution4096 x 2304 at 60 Hz
Extension
PCIe x4Generation3
x4 signal1 Pce
PCIe Interfaces1x PCIe x4
M.2Slot 1Key IDM
InterfaceNVMe, Optane Memory, PCIe ×4 (Gen 4)
Supported dimensions2242, 2280
Slot 2Key IDB
Interface4G/LTE, 5G / Storage Module, PCIe ×1 (Gen 3), SATA III, USB 3.1 Gen 1
Supported dimensions2242, 3042, 3052
Slot 3Key IDE
InterfaceCNVi (Connected Network Interface), USB 2.0
Supported dimensions2230
M.2 Key IDsB, E, M
SIMQuantity1 Pce
Form Factor (Slot)Nano SIM
Audio
ChipsetRealtek ALC888
Network
G-LANControllerChipsetIntel I210IT PCIe (10/100/1000 Mbps), Intel I211AT PCIe (10/100/1000 Mbps)
Quantity2 Pce
ControllerChipsetIntel I225IT PCIe (10/100/1000/2500 Mbps), Intel I225LM PCIe (10/100/1000/2500 Mbps)
Quantity1 Pce
Network3x G-LAN
Externe I/O (Rear Panel)
DisplayHDMI1 Pce
DP++1 Pce
DP USB-C1 Pce
EthernetRJ-453 Pce
USBUSB 3.1 Gen 24 Pce
USB 3.1 (Gen 2, Type-C)1 Pce
Internal I/O
USBUSB 2.0Ports (2.00 mm pitch)4 Pce
SerialRS-232Ports (2.00 mm pitch)2 Pce
RS-232 / 422 / 485Ports (2.00 mm pitch)2 Pce
DisplayLCD / Inverter PowerYes
LVDS (Low Voltage Differential Signaling)Dual channel
LVDS connectors1 Pce
eDP (Embedded DisplayPort) lanes1 Pce
Digital I/OBits8-bit1 Pce
DIO Power4-pin (2 mm pitch)
AudioConnector2.00 mm pitch
Serial ATASATA R3.0 (6 Gbit/s, 600 MB/s)2 Pce
RAID supportRAID 0/1is supported
Power connection (onboard)2 Pce
RAID supportRAID 0/1
Watchdog Timer
Watchdog TimerYes
Watchdog timer (interval)Programmable via software (1 - 255 seconds)
Safety
Trusted Platform Module (TPM)fTPM 2.0 (Firmware Simulation)
Power Supply
Typ (Input)DCWide RangeNo
Range12V
ConnectorMale connector (screw-in)
Power supply - InputDC: 12V
Real-Time Clock (RTC) BatteryCR2032 coin cell battery
OS / Software
Windows EmbeddedWindows 10 Enterprise IoT LTSC (2019)is supported
LinuxDistributionLinux
Supported OSLinux, Windows Embedded
Mechanical / Environment
TemperatureOperation-5° to 65°C, -20° down to 70°C
Storage-40°C to 85°C
Relative humidityOperation5 to 90%, non-condensing
Storage5 to 90%, non-condensing
DimensionsForm factorThin Mini-ITX
Width170 mm
Deep170 mm
Height21,6 mm
Certificates / Conformities
CEYes
FCCClass AYes
Additional certificates / compliance approvalsUKCA
RoHS compliantYes
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