Dynatron R23

LGA 2011

PRODUCT FEATURES

// LGA 2011
// Narrow ILM

PRODUCT PRICE

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PRODUCT INFORMATION

Basic Module: Dynatron R23

General information
SKU / Item NumberR23
Product Basic Data
ManufacturerDynatron
System
ProcessorSeriesIntel Broadwell
SocketLGA 2011 (R3)
Thermal Design Power (TDP)135 W
Cooling
ImplementationPassive
PassiveThermal ManagementCooling Fins (Heat Sink)
InstallationScrew fastening
Mechanical / Environment
DimensionsForm factor2U
Width82 mm
Deep106 mm
Height62 mm
Weight370 g
MaterialCooper Base + Aluminium stacked fin
Certificates / Conformities
RoHS compliantYes
Glühbirne

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