DFI BT700

BT700-B20-N07, BT700-B40-E26, BT700-B40-E45, BT700-E40-E15, BT700-T20-E45, BT700-T40-E45, BT700-T44-E45

Qseven (Q7)

PRODUCT FEATURES

// Qseven (Q7)
// [Intel Atom E3815 | Intel Atom E3826 | Intel Atom E3845 | Intel Celeron N2807]
// [2 GB | 4 GB]
// LVDS|DDI
// 1 x G-LAN
// 1 x USB
// 3 x USB (internal)
// [4 GB | -] eMMC
// 3 x PCIe x1

CONFIGURATION

Please configure your desired product.
Standard Configuration Custom Configuration

PRODUCT PRICE

Prices and delivery times are visible to registered and logged-in customers. New customers can request this information without obligation.

Sales only to business customers.
Delivery time: upon request

Basic Module: DFI BT700

General information
SKU / Item NumberBT700BT700-B20-N07, BT700-B40-E26, BT700-B40-E45, BT700-E40-E15, BT700-T20-E45, BT700-T40-E45, BT700-T44-E45
Product Basic Data
ManufacturerDFI
Product ID770-BT7004-100G, 770-BT7004-200G, 770-BT7004-600G, 770-BT7004-700G, 770-BT7004-800G, 770-BT7004-900G, 770-BT7004-D00G
System
ProcessorSeriesIntel Bay Trail
NumberIntel Atom E3815, Intel Atom E3826, Intel Atom E3845, Intel Celeron N2807
CPU cores1 Pce, 2 Pce, 4 Pce
Threads1 Pce, 2 Pce, 4 Pce
SocketBGA 1170
Base frequency1,46 GHz, 1,58 GHz, 1,91 GHz
Max Turbo Frequency2,16 GHz, -
Cache0,5 MB, 1 MB, 2 MB
Thermal Design Power (TDP)4,3 W, 5 W, 7 W, 10 W
Lithography22 nm
ChipsetSoC (System on a Chip)
MemoryMemory TypeDDR3
DIMM data transfer rateDDR3-1333 MT/s
Maximum expansion4 GB
Internal memory2 GB, 4 GB
StorageEmbedded MultiMedia Card (eMMC)4 GB, -
BIOSAMI SPI 64 Mbit
Graphics
ProcessorIntel HD Graphics
Performance featureSupportDirectX 11, OGL 4.0, OpenCL 1.2
Hardware decodingAVC / H.264, MPEG2, MVC, VC1 / WMV9, VP 8
LVDS (Low Voltage Differential Signaling)Maximum resolution1920 x 1200 at 60 Hz
Bits24-bit
BridgeNXP PTN3460
DDI (Digital Display Interfaces)DPMaximum resolution2560 x 1600 at 60 Hz
DVIMaximum resolution1920 x 1080 at 60 Hz
HDMIMaximum resolution1920 x 1080 at 60 Hz
Extension
PCIe x1x1 Signal (Interface)3 Pce
PCIe Interfaces3x PCIe x1
StorageSD / MMC card
SDIOSpecificationVersion 3.0 (high capacity), Version 3.0 (Physical Layer), Version 3.0 (SDIO)
Audio
ChipsetSupports High Definition Audio interface
Network
G-LANControllerChipsetIntel I210AT PCIe (10/100/1000 Mbps), Intel I210IT PCIe (10/100/1000 Mbps)
Quantity1 Pce
Network1x G-LAN
External I/O
USBHSIC (High-Speed Inter-Chip)1 Pce
Internal I/O
USBUSB 2.0Interface2 Pce
USB 3.0Interface1 Pce
SMBus1 Pce
LPC1 Pce
I²C (Inter-Integrated Circuit)1 Pce
UARTTx/Rx/CTS/RTS1 Pce
Serial ATAS-ATA R2.0 (3 Gbps, 300 MB/s)2 Pce
Watchdog Timer
Watchdog TimerYes
Watchdog timer (interval)Programmable via software (1 - 255 seconds)
Safety
Trusted Platform Module (TPM)Available Upon Request
Power Supply
Typ (Input)DCWide RangeNo
RangeVCC_RTC (ATX Mode), 5V, 5VSB
ConnectorMXM connector (Q7, 230 pins)
Power supply - InputDC: VCC_RTC (ATX mode), 5V, 5VSB
Typical power consumption13 W
Typical power consumptionMit Atom E3845, 1.91 GHz und 4 GB DDR3L
OS / Software
WindowsWindows 7 (32/64-bit)is supported
Windows 8 (32-bit)is supported
Windows 8 (64-bit)is supported
Windows 8.1 (32-bit)is supported
Windows 8.1 (64-bit)is supported
Supported OSWindows
Mechanical / Environment
TemperatureOperation0° to 60°C, -20° down to 70°C, -40°C to 85°C
Storage-40°C to 85°C
Relative humidityOperation5 to 90%, non-condensing
DimensionsForm factorQseven (Q7)
Width70 mm
Deep70 mm
MTBF (Mean Time Between Failures)MTBF at 25°C1.076.860 h
MTBF at 45°C638.931 h
Calculation modelTelcordia Issue 2, Method I Case 3
EnvironmentGB, GC - Ground Benign, Controlled
Certificates / Conformities
CEYes
FCCClass BYes
CompatibilityQseven (Q7) Specification Revision 2.0
RoHS compliantYes
Lifecycle
Production startQ4/2014
Expected untilQ1/2028
Manufacturer's warranty
Manufacturer's warranty2 years
   +49 6122 17071 50
LinkedIn Facebook X