Vehicle (In-Vehicle) System
// Vehicle (In-Vehicle) System
// [- | Intel Core i9-10900TE | Intel Xeon W-1270TE]
// [1,8 | 2 | -] GHz
// Passive cooled
// 2 x Display
// 5 x Serial
// 4 x USB (Front page)
// 4 x USB (Back side)
// [4 | 6] x G-LAN (Front page)
// 1 x Mini-PCIe
// 3 x M.2 Slot
// 9 to 48V
Please configure your desired product.
Standard Configuration
Custom Configuration
Sales only to business customers.
Delivery time: upon request
Basic Module: DFI VC500-CMS
| General information | ||||
| SKU / Item Number | VC500-CMS | |||
| Product Basic Data | ||||
| Manufacturer | DFI | |||
| System | ||||
| Processor | Vertical Segment | Embedded | ||
| Series | Intel Comet Lake | |||
| Number | -, Intel Core i9-10900TE, Intel Xeon W-1270TE | |||
| CPU cores | 8 Pce, 10 Pce, - | |||
| Threads | 16 Pce, 20 Pce, - | |||
| Socket | LGA 1200 (H5) | |||
| Base frequency | 1,8 GHz, 2 GHz, - | |||
| Max Turbo Frequency | 4,4 GHz, 4,5 GHz, - | |||
| Cache | 16 MB, 20 MB, - | |||
| Thermal Design Power (TDP) | 35 W | |||
| Lithography | 14 nm | |||
| Chipset | Intel Q470E, Intel W480E | |||
| Memory | Structure | 260-pin DDR4 SO-DIMM | ||
| Memory Type | DDR4 | |||
| Slots | 2 Pce | |||
| Maximum expansion | 64 GB | |||
| ECC (Error-Correcting Code) | -, is supported | |||
| BIOS | AMI SPI 256 Mbit | |||
| Extension | ||||
| Mini-PCIe | Full installation depth | Quantity | 1 Pce | |
| PCIe Interfaces | 1x Mini-PCIe | |||
| M.2 | Slot 1 | Key ID | E | |
| Interface | PCIe ×1 (Gen 3), USB 2.0 | |||
| Supported dimensions | 2230 | |||
| Slot 2 | Key ID | B | ||
| Interface | PCIe ×1 (Gen 3), USB 3.0 | |||
| Supported dimensions | 3042, 3052 | |||
| Slot 3 | Key ID | M | ||
| Interface | NVMe, Optane Memory, PCIe ×4 (Gen. 3), SATA III | |||
| Supported dimensions | 2242, 2280 | |||
| M.2 Key IDs | B, E, M | |||
| Mobile PCI Express Module (MXM) | is supported | |||
| Audio | ||||
| Chipset | Realtek ALC888 | |||
| Network | ||||
| G-LAN | Controller | Chipset | Intel I219 PCIe (10/100/1000 Mbps) | |
| Quantity | 1 Pce | |||
| Controller | Chipset | Intel I210IT PCIe (10/100/1000 Mbps) | ||
| Quantity | 1 Pce | |||
| Controller | Chipset | -, Intel X710-BM2 (1/10 Gbps) | ||
| Quantity | 1 Pce, - | |||
| Network | 2x G-LAN | |||
| Internal I/O | ||||
| Serial | RS-232 | Ports (2.54 mm pitch) | 1 Pce | |
| Serial ATA | SATA R3.0 (6 Gbit/s, 600 MB/s) | 2 Pce | ||
| RAID support | RAID 0/1 | is supported | ||
| RAID support | RAID 0/1 | |||
| Externe I/O (Front Panel) | ||||
| Audio | Line-in | 1 Pce | ||
| Mic-In | 1 Pce | |||
| Ethernet | RJ-45 | 2 Pce | ||
| RJ-45 with PoE | 4 Pce, - | |||
| SFP+ (Enhanced Small Form-factor Pluggable) | 2 Pce, - | |||
| M12 connectors | 4 Pce, - | |||
| Serial | RS-232 | DB-9 | 1 Pce | |
| Digital I/O | Quantity | 2 Pce | ||
| Bits | 16-bit | |||
| Connector | DB-15 | |||
| USB | USB 3.1 Gen 2 | 4 Pce | ||
| Externe I/O (Rear Panel) | ||||
| Display | DP++ | 2 Pce | ||
| DP++ / HDMI Dual Connector | 1 Pce | |||
| Serial | RS-232 / 422 / 485 | DB-9 | 4 Pce | |
| USB | USB 3.1 Gen 2 | 4 Pce | ||
| SIM | Quantity | 3 Pce | ||
| Form Factor (Slot) | Micro SIM | |||
| Sensor | ||||
| 3D sensor | 3D Accelerometer | |||
| Safety | ||||
| Trusted Platform Module (TPM) | dTPM 2.0 (Hardware) | |||
| Power Supply | ||||
| Typ (Input) | DC | Wide Range | Yes | |
| Range | 9 to 48V | |||
| Connector | 3-pin 3W3 connector | |||
| Ignition (IGN) | Yes | |||
| PoE (Power over Ethernet) | Connectors | 4 Pce, - | ||
| Protocol | -, IEEE 802.3af / 15.4W | |||
| Power supply - Input | DC: 9–48V | |||
| Cooling | ||||
| Implementation | Passive | |||
| Passive | Thermal Management | Heat Spreader | ||
| Inserts | ||||
| external | 2.5" installation slot | 2 Pce | ||
| Mechanical / Environment | ||||
| Temperature | Operation | -20° to 60°C | ||
| Storage | -40°C to 85°C | |||
| Relative humidity | Operation | 10 to 95%, non-condensing | ||
| Dimensions | Form factor | Vehicle (In-Vehicle) System | ||
| Width | 235 mm | |||
| Deep | 221 mm | |||
| Height | 87,5 mm | |||
| Vibration | Reference Standard | MIL-STD-810G Method 514.6 | ||
| Shock | Measurement Data | 10G, half sine wave, 11 ms duration | ||
| Reference Standard | MIL-STD-810G Method 516.6 Procedure I | |||
| Weight | 5500 g | |||
| Controls | Power | 1 Pce | ||
| Power (terminal connection) | 1 Pce | |||
| Reset | 1 Pce | |||
| Status indicators | Storage | 1 Pce | ||
| Power | 1 Pce | |||
| System Status | 2 Pce | |||
| Antenna holes | 8 Pce | |||
| Color | Black / silver | |||
| Material | Aluminum, Steel | |||
| Mounting option | Wall Mount | |||
| OS / Software | ||||
| Windows Embedded | Windows 10 Enterprise IoT LTSC (2019) | is supported | ||
| Linux | Distribution | Ubuntu 20.04 | ||
| Supported OS | Linux, Windows Embedded | |||
| Certificates / Conformities | ||||
| CE | Yes | |||
| FCC | Class A | Yes | ||
| Additional certificates / compliance approvals | E-mark | |||
| RoHS compliant | Yes | |||
We are happy to advise you personally.
