DFI ADS103

ADS103-H610IB, ADS103-Q670DB, ADS103-R680DB, ADS103-R680IB

Thin Mini-ITX Mainboards

PRODUCT FEATURES

// Thin Mini-ITX Industrial Mainboards
// LGA 1700 (H6)
// [Intel H610E | Intel Q670E | Intel R680E]
// 260-pin DDR4 SO-DIMM
// LVDS
// [2 | 3] x G-LAN (Back side)
// [4 | 6] x USB (Back side)
// 6 x USB (internal)
// 2 x Seriell I/O
// Digital I/O (8-Bit)
// 1 x PCIe x16
// Power Supply DC 15~36V

CONFIGURATION

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Standard Configuration Custom Configuration

PRODUCT PRICE

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Sales only to business customers.
Delivery time: upon request

Basic Module: DFI ADS103

General information
SKU / Item NumberADS103ADS103-R680DB, 770-ADS1031-000G, ADS103-H610IB, ADS103-Q670DB, ADS103-R680IB
Product Basic Data
ManufacturerDFI
Product ID770-ADS1031-000G, 770-ADS1031-100G, 770-ADS1031-200G, 770-ADS1031-300G
System
ProcessorVertical SegmentEmbedded
SeriesIntel Alder Lake / Raptor Lake
SocketLGA 1700 (H6)
Thermal Design Power (TDP)65 W
ChipsetIntel H610E, Intel Q670E, Intel R680E
MemoryStructure260-pin DDR4 SO-DIMM
Memory TypeDDR4
DIMM TypeUnbuffered SO-DIMM
Frequency3200 MHz
Slots2 Pce
Maximum expansion64 GB
ECC (Error-Correcting Code)is supported, not supported
BIOSAMI SPI 256 Mbit
Graphics
ProcessorIntel UHD Graphics
Performance featureSupportDirectX 12, OpenCL 2.1, OpenGL 4.5
Hardware decodingAVC / H.264, HEVC / H.265, JPEG / MJPEG, MPEG2, VC1 / WMV9, VP 8, VP 9
HW encodingAVC / H.264, HEVC / H.265, JPEG, MPEG2, VP 8, VP 9
Screens (Multi-display)4 displays
DisplayPortMaximum resolution4096 x 2304 at 60 Hz
Dual modeYes (DP++)
LVDS (Low Voltage Differential Signaling)Maximum resolution1920 x 1200 at 60 Hz
Bits24-bit
BridgeNXP PTN3460
eDP (Embedded DisplayPort)Maximum resolution4096 x 2160 at 60 Hz
Extension
PCIe x16x16 signalGeneration5
Quantity1 Pce
PCIe Interfaces1x PCIe x16
M.2Slot 1Key IDE
InterfacePCIe ×1 (Gen 3), USB 2.0
Supported dimensions2230
Slot 2Key IDM
InterfacePCIe ×1 (Gen 3), PCIe ×4 (Gen 4), SATA III
Supported dimensions2280
Slot 3Key IDB
InterfacePCIe ×1 (Gen 3), SATA III, USB 2.0, USB 3.2 Gen 1, USB 3.2 Gen 2
Supported dimensions2242, 3052, 3242
M.2 Key IDsB, E, M
StorageM.2
Audio
ChipsetRealtek ALC888
Network
G-LANControllerChipsetIntel I226V PCIe (10/100/1000/2500 Mbps)
Quantity1 Pce
ControllerChipsetIntel I210AT PCIe (10/100/1000 Mbps), Intel I219LM PCIe with AMT with Core i5/i7 (10/100/1000 Mbps), Intel I219V PCIe (10/100/1000 Mbps)
Quantity1 Pce
ControllerChipset-, Intel I210AT PCIe (10/100/1000 Mbps)
Quantity1 Pce, -
Network2x G-LAN
Externe I/O (Rear Panel)
DisplayDP++1 Pce
DP++ / HDMI Dual Connector1 Pce
AudioLine Out1 Pce
Mic-In1 Pce
EthernetRJ-452 Pce, 3 Pce
USBUSB 2.01 Pce, -
USB 3.2 (Gen 1)1 Pce, -
USB 3.2 (Gen 2)2 Pce, 4 Pce, 6 Pce
Internal I/O
USBUSB 2.0Ports (2.54 mm pitch)4 Pce
USB 3.2Key-A Header (20-pin)2 Pce
SerialRS-232 / 422 / 485Ports (2.54 mm pitch)2 Pce
DisplayLVDS (Low Voltage Differential Signaling)Dual channel
LVDS connectors1 Pce
eDP (Embedded DisplayPort) lanes1 Pce
Digital I/OBits8-bit1 Pce
DIO Power4-pin (2 mm pitch)
SMBus1 Pce
LPC1 Pce
AudioConnector2.00 mm pitch
Serial ATASATA R3.0 (6 Gbit/s, 600 MB/s)2 Pce
RAID supportRAID 0/1/5/10-, is supported
Power connection (onboard)1 Pce
Watchdog Timer
Watchdog TimerYes
Watchdog timer (interval)Programmable via software (1 - 255 seconds)
Safety
Trusted Platform Module (TPM)dTPM 2.0 (Hardware)
Power Supply
Typ (Input)DCWide RangeYes
Range15~36V
ConnectorDC Power Jack
Power supply - InputDC: 15 to 36V
Real-Time Clock (RTC) BatteryCR2032 coin cell battery
OS / Software
Windows EmbeddedWindows 10 Enterprise IoT LTSB (2016)is supported
Windows 10 Enterprise IoT LTSC (2019)is supported
LinuxDistributionLinux
Supported OSLinux, Windows Embedded
Mechanical / Environment
TemperatureOperation-5° to 65°C
Storage-40°C to 85°C
Relative humidityOperation5 to 90%, non-condensing
Storage5 to 90%, non-condensing
DimensionsForm factorThin Mini-ITX
Width170 mm
Deep170 mm
Height38,9 mm
Certificates / Conformities
CEYes
FCCClass BYes
Additional certificates / compliance approvalsUKCA
RoHS compliantYes
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