BCM (Baseboard Management Controller) AR3399RK

Mainboards with Special Sizes

PRODUCT FEATURES

// Special format Industrial Mainboards
// Rockchip RK3399
// SoC (System on a Chip)
// 2 GB
// 1 x HDMI
// LVDS
// 1 x G-LAN
// 3 x USB
// 2 x USB (internal)
// 1 x Seriell I/O
// 16 GB eMMC
// Digital I/O (8-Bit)
// Power Supply DC 12V

PRODUCT PRICE

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Sales only to business customers.
Delivery time: upon request

PRODUCT INFORMATION

Basic Module: BCM (Baseboard Management Controller) AR3399RK

General information
SKU / Item NumberAR3399RK
Product Basic Data
ManufacturerBCM (Baseboard Management Controller)
System
ProcessorSeriesARM Cortex-A72
NumberRockchip RK3399
CPU cores2 Pce
Processor 2SeriesARM Cortex-A53
CPU cores4 Pce
ChipsetSoC (System on a Chip)
MemoryMemory TypeDDR3
Maximum expansion4 GB
Internal memory2 GB
StorageEmbedded MultiMedia Card (eMMC)16 GB
Power supply - InputEmbedded MultiMedia Card (eMMC) 16 GB
Graphics
ProcessorARM Mali-T860 MP4
HDMIVersion1.4b
LVDS (Low Voltage Differential Signaling)Maximum resolution1920 x 1080 at 60 Hz
Bits24-bit
BridgeChrontel CH7511B
Extension
M.2Slot 1Key IDE
InterfacePCIe ×1 (Gen. 2), USB 2.0, WiFi + Bluetooth
Supported dimensions2230
Slot 2Key IDB
Interface4G/LTE, USB 3.0
Supported dimensions2242
M.2 Key IDsB, E
SIMQuantity1 Pce
Form Factor (Slot)Nano SIM
StorageMicro SD
Audio
ChipsetWolfson WM8960
Network
G-LANControllerChipsetMicrel KSZ9031 (10/100/1000 Mbps)
Quantity1 Pce
Network1x G-LAN
External I/O
EthernetRJ-451 Pce
USBUSB 3.02 Pce
USB v3.0 (Type C)1 Pce
DisplayHDMI1 Pce
AudioLine Out1 Pce
Internal I/O
USBUSB 2.0Ports (2.00 mm pitch)2 Pce
SerialRS-232Ports (2.00 mm pitch)1 Pce
DisplayLVDS connectors1 Pce
Digital I/OBits8-bit1 Pce
I²C (Inter-Integrated Circuit)1 Pce
Image Capture InterfacesCamera Input 1MIPI-CSI (Camera Serial Interface)1 Pce
Connector15-pin FPC 1 mm
Quantity1 Pce
AudioConnector2.00 mm pitch
Line-in1 Pce
Mic-In1 Pce
Verstärker1 Pce
I²S1 Pce
Power Supply
Typ (Input)DCRange12V
ConnectorDC Power Jack
Power supply - InputDC: 12V
OS / Software
LinuxKernel4.4
AndroidRelease9
Supported OSLinux, Android
Cooling
ImplementationPassive
PassiveThermal ManagementCooling Fins (Heat Sink)
Mechanical / Environment
TemperatureOperation0° to 60°C
Storage-20° to 80°C
Relative humidityOperation5 to 80%, non-condensing
Storage5 to 90%, non-condensing
DimensionsForm factorSpecial format
Width110 mm
Deep145 mm
Weight200 g
Status indicatorsStorage1 Pce
Power1 Pce
Certificates / Conformities
CEYes
FCCClass BYes
RoHS compliantYes
Manufacturer's warranty
Manufacturer's warranty2 years
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