LGA 1700 / 1851
// Q1
Sales only to business customers.
Delivery time: upon request
Basic Module: Dynatron Q1
| General information | ||||
| SKU / Item Number | Q1 | |||
| Product Basic Data | ||||
| Manufacturer | Dynatron | |||
| System | ||||
| Processor | Series | Intel Alder Lake | ||
| Socket | LGA 1700 (H6) | |||
| Thermal Design Power (TDP) | 125 W | |||
| Cooling | ||||
| Implementation | Passive | |||
| Passive | Thermal Management | Cooling Fins (Heat Sink) | ||
| Installation | Screw fastening | |||
| Mechanical / Environment | ||||
| Dimensions | Width | 90 mm | ||
| Deep | 90 mm | |||
| Height | 27 mm | |||
| Height units | 1 HE | |||
| Weight | 534 g | |||
| Material | Cooper Base + Aluminium stacked fin | |||
| Certificates / Conformities | ||||
| CE | Yes | |||
| RoHS compliant | Yes | |||
We are happy to advise you personally.
