Dynatron B1

LGA 3647

PRODUCT FEATURES

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PRODUCT INFORMATION

Basic Module: Dynatron B1

General information
SKU / Item NumberB1
Product Basic Data
ManufacturerDynatron
System
ProcessorSeriesIntel Skylake
SocketLGA 3647 (P3)
Thermal Design Power (TDP)165 W
Cooling
ImplementationPassive
PassiveThermal ManagementCooling Fins (Heat Sink)
InstallationScrew fastening
Mechanical / Environment
DimensionsForm factor1U
Width78 mm
Deep108 mm
Height27 mm
Weight600 g
MaterialCopper
Certificates / Conformities
RoHS compliantYes
Glühbirne

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