A Compact AI-Ready Thin Mini ITX Motherboard

BCM, USA, 08.04.2025 - The BCM MX-MTLPS is a Thin Mini-ITX motherboard designed to take advantage of Intel’s latest Core™ Ultra 3/5/7 processors, built on the Meteor Lake-PS (MTL-PS) platform. As one of the first Mini-ITX form factor boards to support Intel’s new socketed SoC design, the MX-MTLPS offers an ideal blend of AI acceleration, integrated graphics, and power-efficient compute — all in a low-profile, fanless-capable footprint.

With a strong focus on edge AI, multi-display, and embedded computing, the MX-MTLPS allows system developers to bring mobile-class performance to desktop-style deployments in space-constrained or thermally sensitive environments.  

MX-MTLPS Key Features

• Form Factor: Thin Mini-ITX (170mm x 170mm), low-profile external I/O
• CPU Support: Intel® Core™ Ultra 3/5/7 Processor Series 1 (Meteor Lake-PS, LGA 1851 socket)
• Memory: 2 x DDR5 SO-DIMM slots, up to 64GB (5600 MT/s)
• Display Support: 3 x DisplayPort + 1x eDP/LVDS — supports up to 4 independent displays
• High-Speed I/O: 2 x Thunderbolt 4, 4 x USB 3.2 Gen 2, M.2 M-Key (NVMe), B-Key (5G/LTE), E-Key (Wi-Fi 6/6E)
• Networking: Dual 2.5GbE Ethernet LAN ports (Intel® I226-LM)
• Power Input: 12–24V wide-range DC-in
• Security & Manageability: TPM 2.0, and optional Intel® vPro and iAMT 18.0 (CPU-dependent)

The combination of Thunderbolt 4 connectivity, support for up to four independent displays, and a wide 12–24V DC-in power input makes the MX-MTLPS a highly versatile platform for both fixed installations and mobile or space-constrained embedded systems.

SoC Architecture with Desktop Flexibility by Design

The Meteor Lake-PS platform brings an SoC-based design to the LGA 1851 socket — a first in the embedded and industrial computing space. This architecture allows the MX-MTLPS to combine:

• Fewer components and simplified board layout
• Lower latency and improved power efficiency
• Mobile-grade processing in a desktop-style socketed design

This board supports a wide TDP range — from 15W for fanless operation to 65W for performance-intensive workloads with proper cooling. That flexibility makes it ideal for diverse applications ranging from quiet kiosks to AI inference boxes. 

Core Ultra: The Intelligence Behind the MX-MTLPS

With support for Intel’s LGA 1851-based Core™ Ultra processors, the MX-MTLPS benefits from a new three-engine compute architecture:

CPU + GPU + NPU

• Hybrid CPU Architecture: Combines Performance-cores and Efficient-cores to optimize multitasking and energy efficiency
• Integrated Intel® Arc™ Graphics: Up to 8 Xe-cores provide advanced GPU capabilities
• Intel® AI Boost NPU: A dedicated Neural Processing Unit that offloads AI workloads for real-time, low-power inference

The NPU is a game-changer for edge and embedded systems. It allows smart workloads — like voice recognition, image classification, vision analytics, and anomaly detection — to run locally, with lower power draw than most CPU or GPU alternatives. This enables real-time AI in power-sensitive environments, on-premise and without relying on the cloud. 

Supported Processors

Intel® Core™ Ultra Processors (Series 1)Intel® Core™ Ultra 7 Processor 165UL (12M Cache, up to 4.90 GHz)

Intel® Core™ Ultra 7 Processor 165HL (24M Cache, up to 5.00 GHz)

Intel® Core™ Ultra 7 Processor 155UL (12M Cache, up to 4.80 GHz)

Intel® Core™ Ultra 7 Processor 155HL (24M Cache, up to 4.80 GHz)

Intel® Core™ Ultra 5 Processor 135UL (12M Cache, up to 4.40 GHz)

Intel® Core™ Ultra 5 Processor 135HL (18M Cache, up to 4.60 GHz)

Intel® Core™ Ultra 5 Processor 125UL (12M Cache, up to 4.30 GHz)

Intel® Core™ Ultra 5 Processor 125HL (18M Cache, up to 4.50 GHz)

Intel® Core™ Ultra 3 Processor 105UL (10M Cache, up to 4.20 GHz)

Ideal Use Cases for MX-MTLPS

AI at the Edge: Leverage the integrated NPU (Intel® AI Boost) for real-time, power-efficient inference at the device level.

Industrial Automation: Fanless-capable design, 24/7 reliability, DC-in power input, and robust I/O make it ideal for factory and control systems (industrial automation).

Smart Retail & Kiosk Terminals: Low-profile, compact form factor with Thunderbolt 4 and multi-display support — perfect for interactive signage (digital signage) and POS (retail).

Medical Imaging & HMI: Quiet, compact, and high-performance — suitable for high-res displays, graphical interfaces, and regulated environments in medical and healthcare.

Network Security & UTM Appliances: Dual 2.5GbE and DDR5 memory support make it a solid platform for high-throughput data handling and firewall deployments.

Sample Availability & Roadmap

MX-MTLPS engineering samples will be available for evaluation in April to early May 2025. BCM supports full product lifecycle services and revision control for long-term industrial deployments.  

ODM & Customization Options

BCM offers ODM (Original Design Manufacturing) support based on the MX-MTLPS platform. Customized I/O configurations, BIOS, thermal design, branding, and mechanical adaptation are available — making it easier for OEMs and integrators to accelerate their time-to-market.