
ECM-RPLP 3,5" SBC with 13th Gen Intel® Core™ Mobile Processor

BCM, USA, 18.07.2023 - BCM introduces its ECM-RPLP, a palm size 3,5" SBC which is designed based on the 13th Gen Intel® Core™ mobile processor platform. The board is a cost effective, low power platform delivering features for performance(28W)/modern (15W) thin and light IoT Edge and AI computing applications. ODM services are available for applications that require 14-Core performance, the Raptor Lake H (45W) series.
13th Gen Intel® Core™ i7/i5/i3 scalable SoC Processor Onboard, formerly Raptor Lake U (15W) and P (28W) Platform
- Intel® Core™ i7-1365UE (15W)
- Intel® Core™ i5-1345UE (15W)
- Intel® Core™ i3-1315UE (15W)
- Intel® Core™ i7-1370PE (28W)
- Intel® Core™ i5-1350PE (28W)
- Intel® Core™ i3-1320PE (28W)
ECM-RPLP Hardware Features
- The Raptor Lake U-series provides up to 15W processor base power. P-series up to 28W
- Fanless operation with the 15W processor
- Select Core™ i7/i5 processors are vPro Eligible with Intel® Active Management Technology
- Select Core™ i7/i5 processors provide integrated Intel® Iris Xe GPU Graphics Engine for Media, Graphics, Display, and light-AI applications Integrates hardware-accelerated AI with Intel® Deep Learning Boost (Intel® DL Boot)
- Supports DDR5 4800MHz memory up to 64GB
- Supports Intel® Wi-Fi 6E and Bluetooth via M.2 modules
- Supports 3 independent displays: 2 x DP and LVDS or eDP (optional)
- Integrated USB Type C Thunderbolt 4
- 2 x 2.5 GbE LAN Ports
- 3 x M.2 sockets: M.2 E-Key CNVi, M.2 M-Key NVMe, M.2 B-Key Nano SIM Card Slot for cellular communication
- 4 x USB 3.2, 3 x USB 2.0, 4 x COM Ports, 1 x SATA III
- Available in NUC-type embedded system chassis with I/O flexibility of maximizing USB capability by adding additional USB ports
Market Applications
The BCM ECM-RPLP 3,5" offers a range of hardware features that make it well-suited for a variety of applications including Retail, Banking, Education, Hospitality, Healthcare, Vision, and Security.
Herausgeber der Meldung (Text / Bild): BCM Advanced Research, www.bcmcom.com
Passende Produkte
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Industrie-Mainboards3,5" Mainboards ECM-RPLP3,5" Industrie-Mainboards
[Intel Core i3-1315UE | Intel Core i5-1335UE | Intel Core i7-1365UE]
SoC (System-On-Chip)
262 Pin SO-DIMM DDR5
LVDS
2 x G-LAN (Rückseite)
4 x USB (Rückseite)
3 x USB (intern)
4 x Seriell I/O
Digital I/O (8-Bit)
Stromversorgung DC 12~24V+9