BCM launches six industrial motherboards built with the 12th Gen Intel® Core™ Processor family, codenamed, Alder Lake

BCM, USA, 01.02.2022 - BCM Advanced Research, a global supplier of industrial PC solutions and motherboards and Titanium member of the Intel® Partner Alliance, announces the launch of six new industrial motherboard products based on the latest 12th Gen Intel® Core™ Processor family codenamed Alder Lake. These six new industrial motherboards are available in ATX, Micro ATX, and Mini-ITX form factors. These motherboards are built with Intel® H610E/R680E/Q670E PCH and the LGA1700 CPU socket supporting 12th Gen Intel® Core™ i9/i7/i5/i3 processors. The Intel® Alder Lake platform provides many game changing technology enhancements such as DDR5 memory support, Gen 4 and Gen 5 PCIe connectivity, and DMI 4.0, USB 3.2, and Intel® iRIS Xe Graphics support on select 12th Gen processors.

For the ATX form factor, BCM provides the BC680R. For Micro ATX form factor, RX680R, RX610H are available. There are three Mini-ITX motherboards that BCM will also bring to the table including the MX670QD, MX610HD (Thin Mini-ITX), and MX610H. Most of these products will be available for sampling in Q1 and production starting in Q2 2022.

The 12th Gen Intel® Core™ processor family is the first Intel® Core™ processors to feature performance hybrid architecture combining Performance-cores and Efficient-cores with Intel® Thread Director to deliver intelligent workload optimization. It is a breakthrough Core™ technology which will help to enhance background task management, multitasking, and focused multithread throughput scenarios for applications that require high performance, high efficiency, and lower power consumption for certain tasks.

For graphic performance, BCM’s 12th Gen Intel® Core™ based motherboards are provided with integrated Intel® UHD Graphics 770 display virtualization and up to four independent displays onboard via HDMI 1.4/2.0b and/or DP 1.4a/4K/HDR video interfaces. Select processors support Intel® iRIS® Xe graphics.

In addition, BCM’s new motherboards provide multiple PCIe 5.0 ready/PCIe 4.0, M.2 NVMe/CNVi expansion interfaces, DDR5 memory slots, and dual 2.5 GbE RJ45 LAN ports combined with security and manageability features, and AI enablement to help boost productivity and fuel future innovation in IoT applications.

Other features to highlight include support for thunderbolt 4 on select motherboards, USB 3.2 with 20Gbps data transfer rate, 3-6 serial ports, I2C, SMBus, as well as Windows 10/11 and Linux OS support.

“With so many breakthrough core technology features, enhanced graphics, AI and accelerated platform innovations provided by the 12th Gen Intel® Core™ processor platform, we are able to implement and optimize as many features as possible into the industrial motherboards we are offering to our customers, not just as our standard off-the-shelf products with scalable performance, but also to many of our ODM customers who have been asking to migrate their older systems onto this platform.” said Tom Skibinski, Sr. VP of Sales and Marketing with BCM Advanced Research. “Being an IPA partner, BCM has been focusing on Intel® x86 based computing hardware for the medical, gaming, and retail industries for decades. I believe this new platform will enable BCM to open doors for more business opportunities in other high compute performance markets such as the Intelligent Transportation Systems, High-performance Server Applications, and Autonomous Robotics where performance, AI, machine learning, computer vision, 5G/Wi-Fi 6 communications and security dominate.” added Skibinski.